2023年谢菲尔德大学电子和电气工程专业硕士申请条件-学费-世界排名

项目背景

更新时间:2024-07-09

专业排名N/A

大学谢菲尔德大学

开学时间9月

课程学制1年

学费29700.00/GBP

专业介绍

Prepare for a career in industry or research. You'll further your understanding of electronic and electrical devices and systems, experience a wide range of topics and, finally, specialise in an area that particularly interests you.Electronic and electrical engineering is a broad and rapidly expanding set of disciplines. Building on core teaching in electrical machines, electronic materials, and the way that electronic circuits interact, this course will allow you to choose from a wide range of optional modules from all our active research areas to tailor your learning in a way that meets with your requirements.

语言要求

类型

雅思

托福

PTE

Listen

Speak

Read

Write

总分

6.5

学术要求

专业领域：电子/电气工程、物理、数学和其他涉及significant数学和相关技术模块的工程专业。

科目：数学+相关的technical科目。

Date of Equal Consideration，即在规定日期之前递交申请，学校会根据录取要求公平考核。超过日期，学校则会加入其他偏向性要素如地域或国家之类。

课程设置

Core modules：核心模块 MSc Investigative Research Project：理学硕士调查研究项目 Optional modules ：可选模块 AC Machines：交流电机 Advanced Control of Electric Drives：电力驱动的高级控制 Energy Storage Management：储能管理 Motion Control and Servo Drives：运动控制和伺服驱动器 Permanent Magnet Machines and Actuators：永磁电机和执行器 Power Electronics Converters：电力电子转换器 Power Semiconductor Devices：功率半导体器件 Advanced Computer Systems：先进的计算机系统 Advanced Integrated Electronics：先进的集成电子 Advanced Signal Processing：高级信号处理 Semiconductor Materials：半导体材料 Principles of Semiconductor Device Technology：半导体器件技术原理 Nanoscale Electronic Devices：纳米级电子器件 Energy Efficient Semiconductor Devices：节能半导体器件 Optical Communication Devices and Systems：光通信设备和系统 Electronic Communication Technologies：电子通信技术 Data Coding Techniques for Communication and Storage：用于通信和存储的数据编码技术 Principles of Communications：通信原则 Antennas, Propagation and Satellite Systems：天线、传播和卫星系统 Mobile Networks and Physical Layer Protocols：移动网络和物理层协议 System Design：系统设计 Broadband Wireless Techniques：宽带无线技术 Wireless Packet Data Networks and Protocols：无线分组数据网络和协议 Packaging and Reliability of Microsystems：微系统的封装和可靠性